DOC Riga 2018 announcement
Dear students and young scientists,
We are pleased to invite you to the 14th international conference “Developments in Optics and Communications 2018” (DOC Riga 2018), organized by the University of Latvia SPIE and OSA Student chapters. The event will take place in April 12 – 13, 2018 in Riga, Latvia.
This conference brings together young scientists and students working in the fields of optics and photonics to share ideas for research and to establish contacts for future collaborations. The official language of this conference is English.
Conference topics are:
- Laser Physics and Spectroscopy;
- Optical Materials and Phenomena;
- Optics in Communications;
- Vision Science;
- Optics and Material Science.
The conference venue is in the University of Latvia Academic Centre for Natural Sciences, located at Jelgavas Street 1, Riga, Latvia
Online registration and abstract submission
till 14th of January, 2018, 23:59, UTC+2.
Please check your visa requirements online
before traveling to Latvia!
If you need an official invitation letter to obtain a visa, please contact the organizing committee before the 14th of January, 2018.
Grants and Financial support
Limited amount of travel grants for covering travel expenses and accommodation will be available to international students. To apply for the grant, please, contact the organizing committee before 14th of January, 2018.
The participation fee must be paid only after the registration is approved.
Standard participation fee:
Early Bird before December 24, 2017 // 7.00 €
after December 24, 2017 // 10.00 €
Special participation fee for University of Latvia SPIE (UL SPIE) and OSA Student chapter member
s // 5.00 €
Attendance only (no presentation or poster)
// free of charge
Payment can be made by bank transfer:
Starptautiska Lietiskas Optikas biedriba
Reg. No.: LV 40008007223
Text in the transfer explanation: DOC2018 and your name (e.g., DOC2018, John Smith).
Organizing committee: firstname.lastname@example.org
Follow us on FB: www.facebook.com/ULSPIE
Looking forward to seeing you there!